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XC3S2000-4FG900C

XC3S2000-4FG900C

XC3S2000-4FG900C

Xilinx Inc.

1.2V V 2.6mm mm FPGAs Spartan?-3 Series 900-BBGA 1mm mm 900

SOT-23

XC3S2000-4FG900C Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 900-BBGA
Surface MountYES
Operating Temperature0°C~85°C TJ
PackagingBulk
Published 2009
Series Spartan®-3
JESD-609 Code e0
Pbfree Code no
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 900
ECCN Code 3A991.D
Terminal Finish Tin/Lead (Sn63Pb37)
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.14V~1.26V
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.2V
Terminal Pitch1mm
Reach Compliance Code not_compliant
[email protected] Reflow Temperature-Max (s) 30
Pin Count900
JESD-30 Code S-PBGA-B900
Number of Outputs 565
Qualification StatusNot Qualified
Operating Supply Voltage1.2V
Power Supplies1.21.2/3.32.5V
Number of I/O 565
RAM Size 90kB
Clock Frequency 630MHz
Number of Inputs 565
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 46080
Total RAM Bits 737280
Number of Gates2000000
Number of LABs/CLBs 5120
Speed Grade 4
Combinatorial Delay of a CLB-Max 0.61 ns
Height Seated (Max) 2.6mm
Length 31mm
Width 31mm
RoHS StatusNon-RoHS Compliant
In-Stock:2631 items

XC3S2000-4FG900C Product Details

XC3S2000-4FG900C Overview


There is a 900-BBGA package that includes this component. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. The device has 565 I/O ports for more coherent data transfer. There are 46080 logic elements/cells to form a fundamental building block. 1.2V volts power it. There is a Field Programmable Gate Arrays family component in this FPGA part. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates at a voltage of 1.14V~1.26V and uses a battery to supply power. The Spartan?-3 Series is one of the types of FPGAs that belong to this type. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. A total of 565 outputs are incorporated into this device. There is an FPGA model contained in Bulk in order to conserve space. There are a total of 900 terminations. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 737280 bFpga chipss. Fpga electronics is important that this FPGA module has a RAM si90kBe of 90kB in order to ensure that the program will run normally. An array of 5120 LABs/CLBs is built into the FPGA. Design engineers can fully take advantage of its flexibility when operating at 1.2V supply voltage. Fpga electronics operates from a 1.21.2/3.32.5V power supply. As a basic building block, fpga semiconductor consists of 2000000 gates. I am going to present you with a device that is equipped with 900 pins. Most of the time, it uses a crystal oscillating at 630MHz to generate the signal.

XC3S2000-4FG900C Features


565 I/Os
Up to 737280 RAM bits

XC3S2000-4FG900C Applications


There are a lot of Xilinx Inc. XC3S2000-4FG900C FPGAs applications.

  • ADAS
  • Defense Applications
  • Embedded Vision
  • Data Mining
  • Device controllers
  • Aircraft navigation
  • Medical ultrasounds
  • Wireless Communications
  • Enterprise networking
  • Automotive driver's assistance

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