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XC3S4000-5FGG900C

XC3S4000-5FGG900C

XC3S4000-5FGG900C

Xilinx Inc.

1.2V V 2.6mm mm FPGAs Spartan?-3 Series 900-BBGA 1mm mm 900

SOT-23

XC3S4000-5FGG900C Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 900-BBGA
Number of Pins 900
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2009
Series Spartan®-3
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 900
ECCN Code 3A991.D
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.14V~1.26V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.2V
Terminal Pitch 1mm
[email protected] Reflow Temperature-Max (s) 30
Base Part Number XC3S4000
Pin Count 900
Number of Outputs 633
Qualification Status Not Qualified
Operating Supply Voltage 1.2V
Number of I/O 633
RAM Size 216kB
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 62208
Total RAM Bits 1769472
Number of Gates 4000000
Number of LABs/CLBs 6912
Speed Grade 5
Height Seated (Max) 2.6mm
Length 31mm
Width 31mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
27 $151.00037 $4077.00999
XC3S4000-5FGG900C Product Details

XC3S4000-5FGG900C Overview


This package is included in the 900-BBGA package and is available for purchase. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. This device features 633 I/Os in order to transfer data in a more efficient manner. There are 62208 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 1.2V. There is a Field Programmable Gate Arrays family component in this FPGA part. FPGA modules can be attached to development boards using a Surface Mount-connector. Powered by a 1.14V~1.26V supply voltage, fpga chips is able to operate at high speeds. This is a type of FPGA that is part of the Spartan?-3 series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. In this device, there are 633 outputs that can be used. Using the Tray layout, this FPGA model can be contained in a very small amount of space. Fpga chips is designed wFpga chipsh 900 terminations. This device is equipped with 1769472 RAM bits in terms of its RAM si1769472e. In order to find related parts, use the part number XC3S4000 as a base. During the configuration of this FPGA module, the RAM si216kBe reaches 216kB to ensure that the program runs normally. In this case, there are 900 pins on the board. An array of 6912 LABs/CLBs is built into the FPGA. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. The 1.2V supply voltage provides designers with full flexibility in their designs. There are 4000000 gates in its basic building block. There are a total of 900 pins on this device.

XC3S4000-5FGG900C Features


633 I/Os
Up to 1769472 RAM bits
900 LABs/CLBs

XC3S4000-5FGG900C Applications


There are a lot of Xilinx Inc. XC3S4000-5FGG900C FPGAs applications.

  • Software-defined radio
  • Voice recognition
  • Data center hardware accelerators
  • Electronic Warfare
  • OpenCL
  • Camera time adjustments
  • DO-254
  • Industrial Ethernet
  • Data center search engines
  • Wired Communications

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