XC3S400AN-4FG400C Overview

A 400-BGA package is provided with this component. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. This device features 311 I/Os in order to transfer data in a more efficient manner. In order to construct a fundamental building block, 8064 logic elements/cells are required. Fpga chips is powered from a supply voltage of 1.2V. Field Programmable Gate Arrays family FPGA part. With a Surface Mount connector, this FPGA module can be attached to the development board. Fpga chips operates at a voltage of 1.14V~1.26V and uses a battery to supply power. The Spartan?-3AN Series is one of the types of FPGAs that belong to this type. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. In this device, there are 248 outputs that can be used. A model of this FPGA is contained in Tray for the purpose of saving space. As a whole, it has 400 terminations. This device has 368640 RAM bits, which is the number of RAM bits that this device offers. You can find related parts by using the part number XC3S400AN, which is its base part number. During the configuration of this FPGA module, the RAM si45kBe reaches 45kB to ensure that the program runs normally. There are 400 pins on this device. A total of 896 LABs/CLBs make up this FPGA array. Providing that this FPGA is mounted in Surface Mount, it will be able to perform according to its specifications in a flawless manner. When operating with the supply voltage of 1.2V, designers can fully make use of its flexibility. This is a battery operated device that operates on 1.21.2/3.33.3V. 400000 gates make up the basic block of its construction. Featuring 400 pins in total, it is a versatile device. Fpga semiconductor typically uses a crystal oscillating at 667MHz. In order to make the architecture work, 896 CLBs are used.

XC3S400AN-4FG400C Features

311 I/Os
Up to 368640 RAM bits
400 LABs/CLBs

XC3S400AN-4FG400C Applications

There are a lot of Xilinx Inc. XC3S400AN-4FG400C FPGAs applications.

• ASIC prototyping
• Data center hardware accelerators
• Automotive driver's assistance
• Solar Energy
• Automotive advanced driver assistance systems (ADAS)
• Embedded Vision
• Telecommunication
• Medical imaging
• Electronic Warfare
• OpenCL