1.2V V 2.6mm mm FPGAs Spartan?-3 Series 676-BGA 1mm mm 676
SOT-23
XC3S5000-4FGG676I Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
10 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
676-BGA
Number of Pins
676
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2012
Series
Spartan®-3
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
676
ECCN Code
3A991.D
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
1.14V~1.26V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
250
Supply Voltage
1.2V
Terminal Pitch
1mm
[email protected] Reflow Temperature-Max (s)
30
Base Part Number
XC3S5000
Pin Count
676
Number of Outputs
489
Qualification Status
Not Qualified
Operating Supply Voltage
1.2V
Power Supplies
1.21.2/3.32.5V
Number of I/O
489
RAM Size
234kB
Clock Frequency
630MHz
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
74880
Total RAM Bits
1916928
Number of Gates
5000000
Number of LABs/CLBs
8320
Speed Grade
4
Combinatorial Delay of a CLB-Max
0.61 ns
Height Seated (Max)
2.6mm
Length
27mm
Width
27mm
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
40
$146.00075
$5840.03
XC3S5000-4FGG676I Product Details
XC3S5000-4FGG676I Overview
The package that contains this software is called 676-BGA. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 489 I/Os are programmed to ensure a more coherent data transfer. A fundamental building block consists of 74880 logic elements/cells. An electrical supply voltage of 1.2V powers it. FPGA parts like this belong to the Field Programmable Gate Arrays family. With a Surface Mount connector, this FPGA module can be attached to the development board. Fpga chips operates at a voltage of 1.14V~1.26V and uses a battery to supply power. The FPGA belongs to the Spartan?-3 series of FPGAs, and it is one type of FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. There are 489 outputs incorporated in this device. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, the terminations of this piece are 676. There are 1916928 RAM bits that are available with this device. Its base part number XC3S5000 can be used to find related parts. The RAM si234kBe of this FPGA module reaches 234kB so as to guarantee the normal operation of the program during operation. In order to make it work, 676 pins have been designed. 8320 LABs and CLBs are built into this FPGA. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In the case of 1.2V supply voltage, designers can take full advantage of its flexibility. Fpga electronics operates from a 1.21.2/3.32.5V power supply. A basic building block for this type of building block consists of 5000000 gates. Fpga semiconductor is equipped wfpga semiconductorh 676 pin count. Most commonly, this device makes use of an oscillating crystal frequency of 630MHz to operate.
XC3S5000-4FGG676I Features
489 I/Os Up to 1916928 RAM bits 676 LABs/CLBs
XC3S5000-4FGG676I Applications
There are a lot of Xilinx Inc. XC3S5000-4FGG676I FPGAs applications.