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XC3S5000-4FGG676I

XC3S5000-4FGG676I

XC3S5000-4FGG676I

Xilinx Inc.

1.2V V 2.6mm mm FPGAs Spartan?-3 Series 676-BGA 1mm mm 676

SOT-23

XC3S5000-4FGG676I Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 676-BGA
Number of Pins 676
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2012
Series Spartan®-3
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676
ECCN Code 3A991.D
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.14V~1.26V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.2V
Terminal Pitch 1mm
[email protected] Reflow Temperature-Max (s) 30
Base Part Number XC3S5000
Pin Count 676
Number of Outputs 489
Qualification Status Not Qualified
Operating Supply Voltage 1.2V
Power Supplies 1.21.2/3.32.5V
Number of I/O 489
RAM Size 234kB
Clock Frequency 630MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 74880
Total RAM Bits 1916928
Number of Gates 5000000
Number of LABs/CLBs 8320
Speed Grade 4
Combinatorial Delay of a CLB-Max 0.61 ns
Height Seated (Max) 2.6mm
Length 27mm
Width 27mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
40 $146.00075 $5840.03
XC3S5000-4FGG676I Product Details

XC3S5000-4FGG676I Overview


The package that contains this software is called 676-BGA. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 489 I/Os are programmed to ensure a more coherent data transfer. A fundamental building block consists of 74880 logic elements/cells. An electrical supply voltage of 1.2V powers it. FPGA parts like this belong to the Field Programmable Gate Arrays family. With a Surface Mount connector, this FPGA module can be attached to the development board. Fpga chips operates at a voltage of 1.14V~1.26V and uses a battery to supply power. The FPGA belongs to the Spartan?-3 series of FPGAs, and it is one type of FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. There are 489 outputs incorporated in this device. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, the terminations of this piece are 676. There are 1916928 RAM bits that are available with this device. Its base part number XC3S5000 can be used to find related parts. The RAM si234kBe of this FPGA module reaches 234kB so as to guarantee the normal operation of the program during operation. In order to make it work, 676 pins have been designed. 8320 LABs and CLBs are built into this FPGA. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In the case of 1.2V supply voltage, designers can take full advantage of its flexibility. Fpga electronics operates from a 1.21.2/3.32.5V power supply. A basic building block for this type of building block consists of 5000000 gates. Fpga semiconductor is equipped wfpga semiconductorh 676 pin count. Most commonly, this device makes use of an oscillating crystal frequency of 630MHz to operate.

XC3S5000-4FGG676I Features


489 I/Os
Up to 1916928 RAM bits
676 LABs/CLBs

XC3S5000-4FGG676I Applications


There are a lot of Xilinx Inc. XC3S5000-4FGG676I FPGAs applications.

  • Data Center
  • Integrating multiple SPLDs
  • ASIC prototyping
  • Voice recognition
  • Bioinformatics
  • Data center search engines
  • Security systems
  • Cryptography
  • High Performance Computing
  • Automotive

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