XC3S5000-4FGG900C Overview

This package is included in the 900-BBGA package and is available for purchase. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. The I/Os are designed to facilitate a more coherent transfer of data. A fundamental building block contains 74880 logic elements or cells. In order for the device to operate, a supply voltage of 1.2V volts needs to be provided. This FPGA part belongs to the family of Field Programmable Gate Arrays. An attachment Surface Mount allows the FPGA module to be attached to the development board. A supply voltage of 1.14V~1.26V is needed in order for fpga chips to operate. It is a type of FPGA that belongs to the Spartan?-3 series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. A device such as this one has 633 outputs built into it. As a result of space limitations, this FPGA model has been included in Tray. In total, it has 900 terminations on each end. The RAM bits that are offered by this fpga chips are 1916928. For related parts, use its base part number XC3S5000. The FPGA module's RAM si234kBe reaches 234kB in order to ensure that the program operates in a normal manner. 900 pins are designed into the device. The FPGA consists of 8320 LABs/CLBs. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. Design engineers can fully take advantage of its flexibility when operating at 1.2V supply voltage. Power is provided by a 1.21.2/3.32.5V battery that is included with the device. Its basic building block contains 5000000 gates. There are a total of 900 pins on this device. Usually, fpga semiconductor uses a 630MHz crystal.

XC3S5000-4FGG900C Features

633 I/Os
Up to 1916928 RAM bits
900 LABs/CLBs

XC3S5000-4FGG900C Applications

There are a lot of Xilinx Inc. XC3S5000-4FGG900C FPGAs applications.

• Digital signal processing
• Audio
• Image processing
• Broadcast
• Data Mining
• Automotive driver's assistance
• Integrating multiple SPLDs
• Military Temperature
• Medical imaging
• Artificial intelligence (AI)