XC3S5000-5FG900C Overview

As part of the 900-BBGA package, it is included. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. There are 633 I/Os for better data transfer. In order to construct a fundamental building block, 74880 logic elements/cells are required. Power is provided by a 1.2V-volt supply. There is a Field Programmable Gate Arrays family component in this FPGA part. An attachment Surface Mount allows the FPGA module to be attached to the development board. With a supply voltage of 1.14V~1.26V, this device operates with ease. This is a type of FPGA that is part of the Spartan?-3 series of FPGAs. The operating temperature should be kept at 0°C~85°C TJ when operating. The device has 633 outputs that are integrated into it. A model of this FPGA is contained in Bulk for the purpose of saving space. Fpga chips is designed wFpga chipsh 900 terminations. There are 1916928 RAM bits that are available with this device. There is a maximum RAM si234kBe of 234kB on this FPGA module, which is necessary to ensure the normal operation of the program. A total of 8320 LABs/CLBs are included in this FPGA. Its flexibility can be fully utilized when operating with a 1.2V supply voltage. The building block that forms the basis of the system contains 5000000 gates. A total of 900 pins are included in this device.

XC3S5000-5FG900C Features

633 I/Os
Up to 1916928 RAM bits

XC3S5000-5FG900C Applications

There are a lot of Xilinx Inc. XC3S5000-5FG900C FPGAs applications.

• OpenCL
• Audio
• ADAS
• Aerospace and Defense
• Development Boards and Shields for Microcontrollers
• Wireless Communications
• Medical Applications
• Enterprise networking
• Industrial Ethernet
• Electronic Warfare