XC3S500E-4FT256I Overview

In the package 256-LBGA, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 190 I/Os allow data to be transferred in a more coherent manner. A fundamental building block consists of 10476 logic elements/cells. It is powered from a supply voltage of 1.2V. The Field Programmable Gate Arrays family of FPGA parts includes this part. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 1.14V~1.26V battery. As part of the Spartan?-3E series of FPGAs, it is a type of FPGA. When operating the machine, it is important to keep the temperature within -40°C~100°C TJ range. During the installation of this device, 149 outputs were incorporated. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. 256 terminations are present in total. This device has 368640 RAM bits, which is the number of RAM bits that this device offers. For related parts, use its base part number XC3S500E. There is a maximum RAM si45kBe of 45kB on this FPGA module, which is necessary to ensure the normal operation of the program. The device is designed with 256 pins in total. A total of 1164 LABs/CLBs make up this FPGA array. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. When operating with the supply voltage of 1.2V, designers can fully make use of its flexibility. Power is supplied to the device by a 1.21.2/3.32.5V battery. The building block that forms the basis of the system contains 500000 gates. As far as the pin count is concerned, it has 256 pins. It usually uses a 572MHz crystal. During the process of storing and transferring data, 9312 registers are used.

XC3S500E-4FT256I Features

190 I/Os
Up to 368640 RAM bits
256 LABs/CLBs
9312 registers

XC3S500E-4FT256I Applications

There are a lot of Xilinx Inc. XC3S500E-4FT256I FPGAs applications.

• Space Applications
• Software-defined radio
• Filtering and communication encoding
• Electronic Warfare
• Embedded Vision
• Military Temperature
• Telecommunication
• Data center hardware accelerators
• Automation
• Wireless Communications