XC3S700A-4FG484I Overview

There are two packages that contain fpga chips: 484-BBGA package and X package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. This device features 372 I/Os in order to transfer data in a more efficient manner. A fundamental building block consists of 13248 logic elements/cells. Fpga chips is powered from a supply voltage of 1.2V. This FPGA part belongs to the family of Field Programmable Gate Arrays. With a Surface Mount connector, this FPGA module can be attached to the development board. In order for it to operate, the supply voltage must be 1.14V~1.26V . As part of the Spartan?-3A series of FPGAs, it is a type of FPGA. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of -40°C~100°C TJ when operating the machine. During the installation of this device, 288 outputs were incorporated. It is for space saving reasons that this FPGA model is contained in Tray. In total, there are a total of 484 terminations on fpga chips. As far as the RAM bits are concerned, this device offers you a total of 368640. In order to find related parts, you can use its base part number XC3S700A. The RAM si45kBe of this FPGA module reaches 45kB to ensure normal operation of the program. This cable has 484 pins and is designed to connect to a computer. 1472 LABs/CLBs are configured on this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. In the case of 1.2V supply voltage, designers can take full advantage of its flexibility. Powered by a 1.22.5/3.3V power supply, it can be operated by almost anyone. 700000 gates make up the basic block of its construction. I am going to present you with a device that is equipped with 484 pins. It usually uses a crystal oscillating at a frequency of 667MHz in order to do its work.

XC3S700A-4FG484I Features

372 I/Os
Up to 368640 RAM bits
484 LABs/CLBs

XC3S700A-4FG484I Applications

There are a lot of Xilinx Inc. XC3S700A-4FG484I FPGAs applications.

• Scientific Instruments
• Space Applications
• Audio
• Medical Applications
• Data Center
• Artificial intelligence (AI)
• Enterprise networking
• Medical Electronics
• ASIC prototyping
• Wireless Communications