XC3SD3400A-5FGG676C Overview

Fpga chips is supplied in the 676-BGA package. Having 469 I/Os makes data transfers more coherent. A fundamental building block consists of 53712 logic elements/cells. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 1.14V~1.26V. An FPGA belonging to the Spartan?-3A DSP series is referred to as an FPGA. When operating the machine, it is important to keep the temperature within 0°C~85°C TJ range. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. Fpga electronics is worth mentioning that this device provides 2322432 bfpga electronics s of RAM. Related parts can be found by using its base part number XC3SD3400A. A significant amount of RAM is allocated to this FPGA module to ensure that the program can operate normally. Fpga electronics is designed wfpga electronics h 676 pins. 5968 LABs/CLBs are integrated into this FPGA. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. Its flexibility can be fully utilized when operating with a 1.2V supply voltage. There is a maximum operating temperature of 85°C for this module. There should be a temperature difference between 0°C and the operating temperature. Its basic building block contains 3400000 gates. 5968 logic blocks (LABs) make up its basic building blocks. There is a device package provided by 676-FBGA (27x27), which is the supplier.

XC3SD3400A-5FGG676C Features

469 I/Os
Up to 2322432 RAM bits
676 LABs/CLBs
85°C gates
5968 logic blocks (LABs)

XC3SD3400A-5FGG676C Applications

There are a lot of Xilinx Inc. XC3SD3400A-5FGG676C FPGAs applications.

• Automotive
• Artificial intelligence (AI)
• Automotive Applications
• Automotive driver's assistance
• Integrating multiple SPLDs
• Radar and Sensors
• Broadcast
• Medical Applications
• Aerospace and Defense
• Space Applications