XC5VFX30T-1FFG665CES Overview

There are two packages that contain fpga chips: 665-BBGA, FCBGA package and X package. Having 360 I/Os makes data transfers more coherent. A fundamental building block is made up of 32768 logic elements/cells. The Surface Mount-slot on the development board allows you to attach the FPGA module. There is a 0.95V~1.05V-volt supply voltage required for the device to operate. It is a type of FPGA that belongs to the Virtex?-5 FXT series of FPGAs. As far as the operating temperature is concerned, it should be kept within 0°C~85°C TJ when operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Having a RAM bit size of 2506752 means that this device will offer you a lot of memory. If you are looking for related parts, you can use the base part number XC5VFX30T as a starting point. During the configuration of this FPGA module, the RAM si306kBe reaches 306kB to ensure that the program runs normally. 2560 LABs and CLBs are built into this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. When this module is operated at its maximum operating temperature, it reaches 85°C. Fpga electronics is recommended that the operating temperature be higher than 0°C. A basic building block of this system consists of 2560 logic blocks (LABs). The device package supplied by 665-FCBGA (27x27) is one of its suppliers.

XC5VFX30T-1FFG665CES Features

360 I/Os
Up to 2506752 RAM bits
85°C gates
2560 logic blocks (LABs)

XC5VFX30T-1FFG665CES Applications

There are a lot of Xilinx Inc. XC5VFX30T-1FFG665CES FPGAs applications.

• Data center search engines
• Computer hardware emulation
• Space Applications
• Military Temperature
• Automation
• Scientific Instruments
• Filtering and communication encoding
• Server Applications
• ASIC prototyping
• Video & Image Processing