In the package 1760-BBGA, FCBGA, this product is provided. This device features 1200 I/Os in order to transfer data in a more efficient manner. A fundamental building block consists of 331776 logic elements/cells. An FPGA module can be attached to a development board with a Surface Mount-pin. This device is powered by a 0.95V~1.05V battery. It is a type of FPGA that belongs to the Virtex?-5 LX series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 10616832 bFpga chipss. You can find related parts by using the part number XC5VLX330, which is its base part number. There is a maximum RAM si1.3MBe of 1.3MB on this FPGA module, which is necessary to ensure the normal operation of the program. 1153 pins are designed into the device. The FPGA consists of 25920 LABs/CLBs. Providing that this FPGA is mounted in Surface Mount, it will be able to perform according to its specifications in a flawless manner. Its flexibility can be fully utilized when operating with a 1V supply voltage. As a result of the design of this module, the maximum operating temperature reaches 100°C. Fpga electronics is recommended that the operating temperature be higher than -40°C. There are 25920 logic blocks (LABs) in the system, which form its basic building blocks. There is a device package provided by 1760-FCBGA (42.5x42.5), which is the supplier.
XC5VLX330-1FF1760I Features
1200 I/Os Up to 10616832 RAM bits 1153 LABs/CLBs 100°C gates 25920 logic blocks (LABs)
XC5VLX330-1FF1760I Applications
There are a lot of Xilinx Inc. XC5VLX330-1FF1760I FPGAs applications.