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XC5VLX330-1FF1760I

XC5VLX330-1FF1760I

XC5VLX330-1FF1760I

Xilinx Inc.

1V V FPGAs Virtex?-5 LX Series 1760-BBGA, FCBGA

SOT-23

XC5VLX330-1FF1760I Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 1760-BBGA, FCBGA
Number of Pins 1153
Supplier Device Package 1760-FCBGA (42.5x42.5)
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 1999
Series Virtex®-5 LX
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Voltage - Supply 0.95V~1.05V
Base Part Number XC5VLX330
Operating Supply Voltage 1V
Number of I/O 1200
RAM Size 1.3MB
Number of Logic Elements/Cells 331776
Total RAM Bits 10616832
Number of LABs/CLBs 25920
Number of Logic Blocks (LABs) 25920
Speed Grade 1
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
XC5VLX330-1FF1760I Product Details

XC5VLX330-1FF1760I Overview


In the package 1760-BBGA, FCBGA, this product is provided. This device features 1200 I/Os in order to transfer data in a more efficient manner. A fundamental building block consists of 331776 logic elements/cells. An FPGA module can be attached to a development board with a Surface Mount-pin. This device is powered by a 0.95V~1.05V battery. It is a type of FPGA that belongs to the Virtex?-5 LX series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 10616832 bFpga chipss. You can find related parts by using the part number XC5VLX330, which is its base part number. There is a maximum RAM si1.3MBe of 1.3MB on this FPGA module, which is necessary to ensure the normal operation of the program. 1153 pins are designed into the device. The FPGA consists of 25920 LABs/CLBs. Providing that this FPGA is mounted in Surface Mount, it will be able to perform according to its specifications in a flawless manner. Its flexibility can be fully utilized when operating with a 1V supply voltage. As a result of the design of this module, the maximum operating temperature reaches 100°C. Fpga electronics is recommended that the operating temperature be higher than -40°C. There are 25920 logic blocks (LABs) in the system, which form its basic building blocks. There is a device package provided by 1760-FCBGA (42.5x42.5), which is the supplier.

XC5VLX330-1FF1760I Features


1200 I/Os
Up to 10616832 RAM bits
1153 LABs/CLBs
100°C gates
25920 logic blocks (LABs)

XC5VLX330-1FF1760I Applications


There are a lot of Xilinx Inc. XC5VLX330-1FF1760I FPGAs applications.

  • Digital signal processing
  • Device controllers
  • Computer hardware emulation
  • Data Center
  • Scientific Instruments
  • Space Applications
  • Radar and Sensors
  • Industrial,Medical and Scientific Instruments
  • Distributed Monetary Systems
  • Military DSP

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