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XC6SLX25T-3CSG324I

XC6SLX25T-3CSG324I

XC6SLX25T-3CSG324I

Xilinx Inc.

1.2V V 1.5mm mm FPGAs Spartan?-6 LXT Series 324-LFBGA, CSPBGA 0.8mm mm 324

SOT-23

XC6SLX25T-3CSG324I Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 324-LFBGA, CSPBGA
Number of Pins 324
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2008
Series Spartan®-6 LXT
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 324
ECCN Code EAR99
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.14V~1.26V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.2V
Terminal Pitch 0.8mm
[email protected] Reflow Temperature-Max (s) 30
Base Part Number XC6SLX25
Pin Count 324
Number of Outputs 190
Qualification Status Not Qualified
Operating Supply Voltage 1.2V
Number of I/O 190
RAM Size 117kB
Clock Frequency 862MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 24051
Total RAM Bits 958464
Number of LABs/CLBs 1879
Speed Grade 3
Number of Registers 30064
Combinatorial Delay of a CLB-Max 0.21 ns
Height Seated (Max) 1.5mm
Length 15mm
Width 15mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
126 $64.33000 $8105.58
XC6SLX25T-3CSG324I Product Details

XC6SLX25T-3CSG324I Description


A semiconductor business called Xilinx, Inc. focuses on programmable logic devices such field-programmable gate arrays (FPGAs). One such FPGA from Xilinx's Spartan-6 family is the XC6SLX25T-3CSG324I. It contains 1.2 Mb of block RAM, 25,280 logic cells, and a maximum clock speed of 300 MHz. The -3 in the part number denotes that the highest junction temperature at which it functions is 85°C. A 324-ball chip scale package with an integrated heat spreader is referred to as a CSG324I package type.



XC6SLX25T-3CSG324I Features


  • 25,280 logic cells

  • 1.2 Mb block RAM

  • Up to 300 MHz clock frequency

  • On-chip power supplies for core and I/O

  • Power-optimized high-speed transceivers

  • Gigabit Ethernet MAC and Tri-mode Ethernet MAC

  • Dual 12-bit, 1 MSPS analog-to-digital converters (ADCs)

  • 324-ball chip scale package with an integrated heat spreader

  • Differential signaling support for LVDS, HTSTL, and SSTL standards



XC6SLX25T-3CSG324I Applications


  • Automotive: driver assistance, infotainment, and safety systems.

  • Medical: medical imaging, patient monitoring, and diagnostic equipment.

  • High-performance computing: data centers, scientific research, and financial modeling.

  • Industrial automation: motion control, robotics, machine vision, and factory automation.

  • Telecommunications: wireless communication systems, baseband processors, and network processing.

  • Video and image processing: video compression, real-time video processing, and digital signal processing.

  • Aerospace and defense: military communications systems, secure networking, radar systems, and image processing.


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