XC6SLX45T-3CSG324I Overview

In the package 324-LFBGA, CSPBGA, this product is provided. Fpga chips is programmed wFpga chipsh 190 I/Os for transferring data in a more coherent manner. A fundamental building block contains 43661 logic elements or cells. With a Surface Mount connector, this FPGA module can be attached to the development board. In order to operate it, it requires a voltage supply of 1.14V~1.26V . The Spartan?-6 LXT series FPGA is a type of FPGA that belongs to the Spartan?-6 LXT family of FPGAs. Operating temperatures should be maintained within the -40°C~100°C TJ range at all times when the unit is in use. This FPGA model is contained in Tray for space saving. Having a RAM bit size of 2138112 means that this device will offer you a lot of memory. Parts related to this part can be found using its base part number XC6SLX45. The RAM si261kBe of this FPGA module reaches 261kB so as to guarantee the normal operation of the program during operation. 324 pins are designed into the device. A total of 3411 LABs/CLBs make up this FPGA array. Providing that this FPGA is mounted in Surface Mount, it will be able to perform according to its specifications in a flawless manner. Its flexibility is fully utilized when operated with a supply voltage of 1.2V. When this module is operated at its maximum operating temperature, it reaches 100°C. -40°C should be higher than the operating temperature. Its basic building block is composed of 3411 logic blocks (LABs). Fpga semiconductor is important to note that the data is stored and transferred in 54576 different registers. The device package supplied by 324-CSPBGA (15x15) is one of its suppliers.

XC6SLX45T-3CSG324I Features

190 I/Os
Up to 2138112 RAM bits
324 LABs/CLBs
100°C gates
3411 logic blocks (LABs)
54576 registers

XC6SLX45T-3CSG324I Applications

There are a lot of Xilinx Inc. XC6SLX45T-3CSG324I FPGAs applications.

• High Performance Computing
• Automotive advanced driver assistance systems (ADAS)
• Data Center
• Consumer Electronics
• Medical Electronics
• Radar and Sensors
• Artificial intelligence (AI)
• Telecommunication
• Embedded Vision
• Wired Communications