XC6SLX75-3FGG484C Overview

There are two packages that contain fpga chips: 484-BBGA package and X package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 280 I/Os for transferring data in a more coherent manner. A fundamental building block is made up of 74637 logic elements/cells. It is powered from a supply voltage of 1.2V. A Field Programmable Gate Arrays-series FPGA part. Using a Surface Mount connector, you can mount this FPGA module on the development board. This device is powered by a 1.14V~1.26V battery. The Spartan?-6 LX series FPGA is a type of FPGA that belongs to the Spartan?-6 LX family of FPGAs. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~85°C TJ at all times. A total of 280 outputs are incorporated into this device. As a result of space limitations, this FPGA model has been included in Tray. In total, there are a total of 484 terminations on fpga chips. A device like this one offers 3170304 RAM bits, which is a considerable amount of memory. Its base part number XC6SLX75 can be used to find related parts. A significant amount of RAM is allocated to this FPGA module to ensure that the program can operate normally. In this case, 484 pins are used in the design. 5831 LABs and CLBs are built into this FPGA. Providing that this FPGA is mounted in Surface Mount, it will be able to perform according to its specifications in a flawless manner. Designers can fully utilize its flexibility with 1.2V supply voltage. A total of 484 pins are included in this device. Usually, fpga semiconductor uses a 862MHz crystal. During the process of storing and transferring data, 93296 registers are used.

XC6SLX75-3FGG484C Features

280 I/Os
Up to 3170304 RAM bits
484 LABs/CLBs
93296 registers

XC6SLX75-3FGG484C Applications

There are a lot of Xilinx Inc. XC6SLX75-3FGG484C FPGAs applications.

• Space Applications
• Automotive Applications
• Medical imaging
• Broadcast
• Embedded Vision
• Medical Electronics
• Industrial,Medical and Scientific Instruments
• Distributed Monetary Systems
• Wireless Communications
• Video & Image Processing