A 784-BBGA, FCBGA package is provided with this component. Fpga chips is programmed wFpga chipsh 360 I/Os for transferring data in a more coherent manner. A fundamental building block contains 74496 logic elements or cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. Fpga chips operates wFpga chipsh a supply voltage of 0.95V~1.05V. As part of the Virtex?-6 LXT series of FPGAs, it is a type of FPGA. When operating the machine, it is important to keep the temperature within 0°C~85°C TJ range. It is for space saving reasons that this FPGA model is contained in Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 5750784 bFpga chipss. Related parts can be found by using its base part number XC6VLX75T. It is crucial that the RAM si702kBe of this FPGA module reaches 702kB so that the program can run normally. Fpga electronics contains 5820 LABs/CLBs in an array. Providing the FPGA is mounted in Surface Mount as per the specifications of the IC, then it should work perfectly according to its specifications. When operating with the supply voltage of 1V, designers can fully make use of its flexibility. The maximal operating temperature of this module reaches 85°C. Fpga electronics is necessary to maintain an operating temperature higher than 0°C. There are 5820 logic blocks (LABs) in the system, which form its basic building blocks. This device package is supplied by 784-FCBGA (29x29).
XC6VLX75T-2FFG784C Features
360 I/Os Up to 5750784 RAM bits 85°C gates 5820 logic blocks (LABs)
XC6VLX75T-2FFG784C Applications
There are a lot of Xilinx Inc. XC6VLX75T-2FFG784C FPGAs applications.