XC7A200T-1FF1156I Overview

There are two packages that contain fpga chips: 1156-BBGA, FCBGA package and X package. Its 500 I/Os help it transfer data more efficiently. A fundamental building block consists of 215360 logic elements/cells. The Surface Mount-slot connector on the FPGA module can be connected to the development board. There is a 0.95V~1.05V-volt supply voltage required for the device to operate. It is a type of FPGA belonging to the Artix-7 seies. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. Using the Tray layout, this FPGA model can be contained in a very small amount of space. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 13455360 bFpga chipss. Related parts can be found by using its base part number XC7A200T. There is a maximum RAM si1.6MBe of 1.6MB on this FPGA module, which is necessary to ensure the normal operation of the program. The FPGA is built as an array of 16825 latches or CLBs. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. In operation with 1V, designers can take advantage of its flexibility to the fullest extent. A maximum operating temperature of 100°C can be reached by this module. Fpga electronics is recommended that the operating temperature be higher than -40°C. There are 16825 logic blocks (LABs) that make up the system's basic building block. The structure of the registers used to store and transfer data consists of 269200 registers. Device package 1156-FCBGA (35x35) is provided by its supplier.

XC7A200T-1FF1156I Features

500 I/Os
Up to 13455360 RAM bits
100°C gates
16825 logic blocks (LABs)
269200 registers

XC7A200T-1FF1156I Applications

There are a lot of Xilinx Inc. XC7A200T-1FF1156I FPGAs applications.

• High Performance Computing
• Data Mining
• Wired Communications
• Medical ultrasounds
• Data center hardware accelerators
• Computer hardware emulation
• Audio
• ASIC prototyping
• Automotive Applications
• Telecommunication