XC7K325T-1FFG900CES Overview

In the 900-BBGA, FCBGA package, you will find fpga chips. A total of 500 I/Os are programmed to ensure a more coherent data transfer. Logic elements/cells form the fundamental building block of a computer. With a Surface Mount connector, this FPGA module can be attached to the development board. This device is powered by a 0.97V~1.03V battery. The Kintex?-7 Series is one of the types of FPGAs that belong to this type. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~85°C TJ when operating the machine. As a result of space limitations, this FPGA model has been included in Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 16404480 bFpga chipss. In order to find related parts, use the part number XC7K325T as a base. This FPGA module has a RAM si2MBe of 2MB that is sufficient to make sure that the program is able to run normally. Fpga electronics contains 25475 LABs/CLBs in an array. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. During its maximal operating temperature, this module reaches 85°C. Fpga electronics is recommended that the operating temperature be higher than 0°C. Fpga semiconductor consists of 25475 logic blocks (LABs). The device package supplied by 900-FCBGA (31x31) is one of its suppliers.

XC7K325T-1FFG900CES Features

500 I/Os
Up to 16404480 RAM bits
85°C gates
25475 logic blocks (LABs)

XC7K325T-1FFG900CES Applications

There are a lot of Xilinx Inc. XC7K325T-1FFG900CES FPGAs applications.

• Wireless Communications
• Industrial Ethernet
• Solar Energy
• Secure Communication
• Video & Image Processing
• Distributed Monetary Systems
• Automotive driver's assistance
• Data Center
• Industrial IoT
• ADAS