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XC7K325T-2FBG676C

XC7K325T-2FBG676C

XC7K325T-2FBG676C

Xilinx Inc.

2.54mm mm 1GB B FPGAs Kintex?-7 Series 676-BBGA, FCBGA 1mm mm 676

SOT-23

XC7K325T-2FBG676C Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Contact Plating Copper, Silver, Tin
Mounting Type Surface Mount
Package / Case 676-BBGA, FCBGA
Surface Mount YES
Number of Pins 676
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2010
Series Kintex®-7
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 676
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 0.97V~1.03V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Terminal Pitch 1mm
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number XC7K325T
Pin Count 676
Number of Outputs 400
Qualification Status Not Qualified
Power Supplies 11.83.3V
Memory Size 1GB
Number of I/O 400
RAM Size 2MB
Memory Type DDR3
Clock Frequency 1818MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 326080
Total RAM Bits 16404480
Number of LABs/CLBs 25475
Speed Grade -2
Number of Registers 407600
Combinatorial Delay of a CLB-Max 0.61 ns
Height Seated (Max) 2.54mm
Length 27mm
Width 27mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $1,120.60000 $1
XC7K325T-2FBG676C Product Details

XC7K325T-2FBG676C Description


The XC7K325T-2FBG676C is from Xilinx® 7 series FPGAs.



XC7K325T-2FBG676C  Features


  • Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.

  • 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.

  • High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.

  • High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to max. rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.

  • A user-configurable analogue interface (XADC), incorporating dual 12-bit 1MSPS analogue-to-digital converters with on-chip thermal and supply sensors.

  • DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.

  • Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.

  • Quickly deploy embedded processing with MicroBlaze™ processor.

  • Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.

  • Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction



XC7K325T-2FBG676C Applications


  • Industrial


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