-40°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O
SOT-23
XC7Z015-2CL485I Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
10 Weeks
Package / Case
484-LFBGA, CSPBGA
Supplier Device Package
484-CSPBGA (19x19)
Operating Temperature
-40°C~100°C TJ
Packaging
Bulk
Series
Zynq®-7000
Published
2010
Part Status
Active
Moisture Sensitivity Level (MSL)
2A (4 Weeks)
Number of I/O
130
Speed
766MHz
RAM Size
256KB
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Artix™-7 FPGA, 74K Logic Cells
RoHS Status
Non-RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
84
$200.20000
$16816.8
XC7Z015-2CL485I Product Details
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
A core processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is embedded in this SoC.It has been assigned a package 484-LFBGA, CSPBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Zynq®-7000 is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.This SoC security combines Artix™-7 FPGA, 74K Logic Cells and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Bulk package.This SoC part contains a total of 130 I/Os in total.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM. Built on MCU, FPGA.
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XC7Z015-2CL485I System On Chip (SoC) applications.