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XC7Z030-L2FBG484I

XC7Z030-L2FBG484I

XC7Z030-L2FBG484I

Xilinx Inc.

484 Terminations -40°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O 1V

SOT-23

XC7Z030-L2FBG484I Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Package / Case 484-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Zynq®-7000
Published 2010
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Frequency 800MHz
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B484
Supply Voltage-Max (Vsup) 1.05V
Supply Voltage-Min (Vsup) 0.95V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Core Architecture ARM
Boundary Scan YES
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Length 23mm
Height Seated (Max) 2.54mm
Width 23mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $347.10000 $347.1
XC7Z030-L2FBG484I Product Details

This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).


On this SoC, there is Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor.Assigned with the package 484-BBGA, FCBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the Zynq®-7000 series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines Kintex™-7 FPGA, 125K Logic Cells.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 130 I/Os.It is recommended to use a 1V power supply.In the SoCs wireless, voltages above 1.05V are considered unsafe.This SoC system on a chip can run on a power supply that is at least 0.95V.In total, there are 484 terminations, which is great for system on a chip.It operates at a frequency of 800MHz.In terms of core architecture, the SoC meaning relies on ARM.Further features of this SoC processor are PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY


There are a lot of Xilinx Inc.


XC7Z030-L2FBG484I System On Chip (SoC) applications.


  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices

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