CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Core Architecture
ARM
Boundary Scan
YES
RAM (words)
256000
Primary Attributes
Kintex™-7 FPGA, 125K Logic Cells
Number of Registers
157200
Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB
Length
27mm
Height Seated (Max)
2.54mm
Width
27mm
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$399.10000
$399.1
XC7Z030-L2FBG676I Product Details
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
On this SoC, there is Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor.Assigned with the package 676-BBGA, FCBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the Zynq®-7000 series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines Kintex™-7 FPGA, 125K Logic Cells.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 130 I/Os.It is recommended to use a 1V power supply.In total, there are 676 terminations, which is great for system on a chip.It operates at a frequency of 800MHz.In terms of core architecture, the SoC meaning relies on ARM.Further features of this SoC processor are PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.This power supply is rated with a maximum voltage of 1.05V.Power is supplied to it at least in the amount of 950mV.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM. Built on MCU, FPGA. Core Architecture: ARM PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
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