CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Core Architecture
ARM
Boundary Scan
YES
Speed Grade
1
RAM (words)
256000
Primary Attributes
Kintex™-7 FPGA, 275K Logic Cells
Number of Registers
343800
Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max)
3.35mm
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$1,644.50000
$1
XC7Z035-1FFG900I Product Details
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
A core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 900-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq®-7000 is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.This SoC security combines Kintex™-7 FPGA, 275K Logic Cells, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.130 I/Os are available in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 1V.In total, there are 900 terminations, so system on a chip is really aided by this.A frequency of 667MHz is used by the wireless SoC to operate.In order to operate the SoC meaning, it must be based on the core architecture of ARM.The computer SoC is available in 900-pin form.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM. Built on MCU, FPGA. Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z035-1FFG900I System On Chip (SoC) applications.