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XC7Z035-1FFG900I

XC7Z035-1FFG900I

XC7Z035-1FFG900I

Xilinx Inc.

900 Terminations -40°C~100°C TJ 900 Pin System On Chip Zynq®-7000 Series 130 I/O 1V

SOT-23

XC7Z035-1FFG900I Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Package / Case 900-BBGA, FCBGA
Surface Mount YES
Number of Pins 900
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Zynq®-7000
Published 2010
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Frequency 667MHz
Time@Peak Reflow Temperature-Max (s) 30
Operating Supply Voltage 1V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Propagation Delay 130 ps
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Core Architecture ARM
Boundary Scan YES
Speed Grade 1
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells
Number of Registers 343800
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max) 3.35mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $1,644.50000 $1
XC7Z035-1FFG900I Product Details

This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).


A core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 900-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq®-7000 is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.This SoC security combines Kintex™-7 FPGA, 275K Logic Cells, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.130 I/Os are available in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 1V.In total, there are 900 terminations, so system on a chip is really aided by this.A frequency of 667MHz is used by the wireless SoC to operate.In order to operate the SoC meaning, it must be based on the core architecture of ARM.The computer SoC is available in 900-pin form.

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM


There are a lot of Xilinx Inc.


XC7Z035-1FFG900I System On Chip (SoC) applications.


  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness

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