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XC7Z035-L2FFG900I

XC7Z035-L2FFG900I

XC7Z035-L2FFG900I

Xilinx Inc.

900 Terminations -40°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O 1V

SOT-23

XC7Z035-L2FFG900I Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Package / Case 900-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Zynq®-7000
Published 2010
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch 1mm
Frequency 800MHz
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B900
Supply Voltage-Max (Vsup) 1.05V
Supply Voltage-Min (Vsup) 0.95V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Core Architecture ARM
Boundary Scan YES
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Length 31mm
Height Seated (Max) 3.35mm
Width 31mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $2,147.58000 $2
XC7Z035-L2FFG900I Product Details

This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).


Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, this SoC has been developed.There is a 900-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq®-7000 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of Kintex™-7 FPGA, 275K Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 130 inputs and outputs.Ideally, a power supply with a voltage of 1V should be used.An excessive voltage of 1.05V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As long as it receives a power supply that is at least 0.95V, it should be able to function.system on a chip benefits from 900 terminations.During operation, the wireless SoC runs at a frequency of 800MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.Aside from that, this SoC processor is also equipped with some additional features that are present in PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY


There are a lot of Xilinx Inc.


XC7Z035-L2FFG900I System On Chip (SoC) applications.


  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical
  • Remote control

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