Welcome to Hotenda.com Online Store!

logo
userjoin
Home

XC7Z045-L2FFG900I

XC7Z045-L2FFG900I

XC7Z045-L2FFG900I

Xilinx Inc.

900 Terminations -40°C~100°C TJ System On Chip Zynq®-7000 Series 130 I/O 1V

SOT-23

XC7Z045-L2FFG900I Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Package / Case 900-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Zynq®-7000
Published 2010
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch 1mm
Frequency 800MHz
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B900
Supply Voltage-Max (Vsup) 1.05V
Supply Voltage-Min (Vsup) 0.95V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Core Architecture ARM
Boundary Scan YES
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 350K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Length 31mm
Height Seated (Max) 3.35mm
Width 31mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
XC7Z045-L2FFG900I Product Details

This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).


Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, this SoC has been developed.The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Zynq®-7000 series of system on a chips.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines Kintex™-7 FPGA, 350K Logic Cells together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 130 I/Os.For safe operation, it is advisable to utilize a power supply with 1V voltage.In the SoCs wireless, high voltages above 1.05V are considered dangerous and should not be used.In order to run it, it must be fed by at least 0.95V of power.The system on a chip uses 900 terminations in total.A wireless SoC that operates at a frequency of 800MHz is what the wireless SoC does.This SoC meaning utilizes a core architecture of ARM as its foundation.Furthermore, this SoC processor also incorporates additional features similar to PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY which are available on other SoC processors also.

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY


There are a lot of Xilinx Inc.


XC7Z045-L2FFG900I System On Chip (SoC) applications.


  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical

Related Part Number

IB916AF-7300
XCZU5EG-2FBVB900I
XC7Z030-2SBG485E
XC7Z030-2SBG485E
$0 $/piece
10AS032E3F27E2SG
10AS032E3F27E2SG
$0 $/piece
XCZU5EG-L2SFVC784E

Get Subscriber

Enter Your Email Address, Get the Latest News