950mV V 2.4MB B FPGAs Kintex? UltraScale? Series 676-BBGA, FCBGA 676
SOT-23
XCKU035-1FBVA676I Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
10 Weeks
Contact Plating
Copper, Silver, Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
676-BBGA, FCBGA
Number of Pins
676
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2006
Series
Kintex® UltraScale™
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
676
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Technology
CMOS
Voltage - Supply
0.922V~0.979V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
0.95V
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of Outputs
312
Qualification Status
Not Qualified
Operating Supply Voltage
950mV
Power Supplies
0.95V
Memory Size
2.4MB
Number of I/O
312
RAM Size
2.4MB
Memory Type
RAM
Number of Logic Elements/Cells
444343
Total RAM Bits
19456000
Number of LABs/CLBs
25391
Speed Grade
1
Number of Registers
406256
Max Junction Temperature (Tj)
100°C
Height
2.71mm
Length
27mm
Width
27mm
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
XCKU035-1FBVA676I Product Details
XCKU035-1FBVA676I Overview
There is a 676-BBGA, FCBGA package that includes this component. There are 312 I/Os for better data transfer. A fundamental building block is made up of 444343 logic elements/cells. Fpga chips is powered from a supply voltage of 0.95V. With a Surface Mount connector, this FPGA module can be attached to the development board. This device is powered by a 0.922V~0.979V battery. The FPGA belongs to the Kintex? UltraScale? series of FPGAs, and it is one type of FPGA. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of -40°C~100°C TJ when operating the machine. In this device, there are 312 outputs that can be used. As a result of space limitations, this FPGA model has been included in Tray. The total number of terminations is 676. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 19456000 bFpga chipss. During the configuration of this FPGA module, the RAM si2.4MBe reaches 2.4MB to ensure that the program runs normally. The device has 676 pins which are included in the design. The FPGA is built as an array of 25391 latches or CLBs. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. The 950mV supply voltage provides designers with full flexibility in their designs. Power is provided by a 0.95V battery that is included with the device. A memory of 2.4MB is embedded in this FPGA module for storing data and programs. During the process of storing and transferring data, 406256 registers are used. The RAM memory is adopted for storing data and avoiding resource conflicts.
XCKU035-1FBVA676I Features
312 I/Os Up to 19456000 RAM bits 676 LABs/CLBs 406256 registers
XCKU035-1FBVA676I Applications
There are a lot of Xilinx Inc. XCKU035-1FBVA676I FPGAs applications.