950mV V 2.71mm mm FPGAs Kintex? UltraScale? Series 676-BBGA, FCBGA 1mm mm 676
SOT-23
XCKU035-3FBVA676E Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
10 Weeks
Contact Plating
Copper, Silver, Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
676-BBGA, FCBGA
Number of Pins
676
Operating Temperature
0°C~100°C TJ
Packaging
Bulk
Published
2012
Series
Kintex® UltraScale™
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
676
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Subcategory
Field Programmable Gate Arrays
Packing Method
TRAY
Technology
CMOS
Voltage - Supply
0.970V~1.030V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
1V
Terminal Pitch
1mm
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of Outputs
312
Qualification Status
Not Qualified
Operating Supply Voltage
950mV
Power Supplies
1V
Number of I/O
312
RAM Size
2.4MB
Organization
1700 CLBS
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
444343
Total RAM Bits
19456000
Number of LABs/CLBs
25391
Speed Grade
3
Number of Registers
406256
Number of CLBs
1700
Height Seated (Max)
2.71mm
Length
27mm
Width
27mm
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
XCKU035-3FBVA676E Product Details
XCKU035-3FBVA676E Overview
Fpga chips is supplied in the 676-BBGA, FCBGA package. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. A total of 312 I/Os allow data to be transferred in a more coherent manner. A fundamental building block contains 444343 logic elements or cells. Supply voltage is 1V volts. FPGA parts like this belong to the Field Programmable Gate Arrays family. The Surface Mount-slot connector on the FPGA module can be connected to the development board. In order to operate it, it requires a voltage supply of 0.970V~1.030V . FPGAs belonging to the Kintex? UltraScale? series are a type of FPGA that belong to the Kintex? UltraScale? series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~100°C TJ while the machine is operating. A device such as this one has 312 outputs built into it. There is an FPGA model contained in Bulk in order to conserve space. In total, there are a total of 676 terminations on fpga chips. There are 19456000 RAM bits that are available with this device. The RAM si2.4MBe of this FPGA module reaches 2.4MB so as to guarantee the normal operation of the program during operation. In this case, 676 pins are used in the design. The FPGA consists of 25391 LABs/CLBs. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. In operation with 950mV, designers can take advantage of its flexibility to the fullest extent. Power is provided by a 1V battery that is included with the device. The structure of the registers used to store and transfer data consists of 406256 registers. The architecture of the system is based on 1700 CLBs. Due to most industry design purposes, fpga circuit adapts the packing method TRAY.
XCKU035-3FBVA676E Features
312 I/Os Up to 19456000 RAM bits 676 LABs/CLBs 406256 registers
XCKU035-3FBVA676E Applications
There are a lot of Xilinx Inc. XCKU035-3FBVA676E FPGAs applications.