2.71mm mm FPGAs Kintex? UltraScale? Series 676-BBGA, FCBGA 1mm mm 676
SOT-23
XCKU035-L1FBVA676I Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
10 Weeks
Mounting Type
Surface Mount
Package / Case
676-BBGA, FCBGA
Surface Mount
YES
Operating Temperature
-40°C~100°C TJ
Packaging
Bulk
Published
2012
Series
Kintex® UltraScale™
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
676
ECCN Code
3A991.D
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Packing Method
TRAY
Technology
CMOS
Voltage - Supply
0.880V~0.979V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
0.9V
Terminal Pitch
1mm
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
S-PBGA-B676
Number of Outputs
312
Qualification Status
Not Qualified
Power Supplies
0.9V
Number of I/O
312
Number of Inputs
312
Organization
1700 CLBS
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
444343
Total RAM Bits
19456000
Number of LABs/CLBs
25391
Number of CLBs
1700
Height Seated (Max)
2.71mm
Length
27mm
Width
27mm
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
XCKU035-L1FBVA676I Product Details
XCKU035-L1FBVA676I Overview
This package is included in the 676-BBGA, FCBGA package and is available for purchase. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Its 312 I/Os help it transfer data more efficiently. A fundamental building block is made up of 444343 logic elements/cells. It is powered from a supply voltage of 0.9V. The Field Programmable Gate Arrays family of FPGA parts includes this part. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 0.880V~0.979V-volt supply voltage required for the device to operate. The FPGA belongs to the Kintex? UltraScale? series of FPGAs, and it is one type of FPGA. The operating temperature should be kept at -40°C~100°C TJ when operating. In this device, there are 312 outputs that can be used. Fpga chips is designed to maximiBulke space efficiency by containing the FPGA model in Bulk. In total, there are a total of 676 terminations on fpga chips. As far as the RAM bits are concerned, this device offers you a total of 19456000. The FPGA consists of 25391 LABs/CLBs. Fpga electronics operates from a 0.9V power supply. An architecture consists of 1700 CLBs. Using the TRAY packing method, it is suitable for most industrial design purposes.
XCKU035-L1FBVA676I Features
312 I/Os Up to 19456000 RAM bits
XCKU035-L1FBVA676I Applications
There are a lot of Xilinx Inc. XCKU035-L1FBVA676I FPGAs applications.