XCKU035-L1FBVA900I Overview

This package is included in the 900-BBGA, FCBGA package and is available for purchase. There are 468 I/Os for better data transfer. To form a fundamental building block, there are 444343 logic elements/cells. With a Surface Mount connector, this FPGA module can be attached to the development board. This device is powered by a 0.880V~0.979V battery. An FPGA belonging to the Kintex? UltraScale? series is referred to as an FPGA. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. It is for space saving reasons that this FPGA model is contained in Bulk. As far as the RAM bits are concerned, this device offers you a total of 19456000. The FPGA is built as an array of 25391 latches or CLBs. It employs 900-FCBGA (31x31) as its supplier device package.

XCKU035-L1FBVA900I Features

468 I/Os
Up to 19456000 RAM bits

XCKU035-L1FBVA900I Applications

There are a lot of Xilinx Inc. XCKU035-L1FBVA900I FPGAs applications.

• Camera time adjustments
• Radar and Sensors
• Wireless Communications
• OpenCL
• Data Center
• Defense Applications
• Artificial intelligence (AI)
• Industrial Ethernet
• Automotive advanced driver assistance systems (ADAS)
• Wired Communications