2.71mm mm FPGAs Kintex? UltraScale? Series 676-BBGA, FCBGA 1mm mm 676
SOT-23
XCKU040-2FBVA676E Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
10 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
676-BBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Published
2012
Series
Kintex® UltraScale™
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
676
ECCN Code
3A991.D
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
0.922V~0.979V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
0.95V
Terminal Pitch
1mm
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
S-PBGA-B676
Number of Outputs
312
Qualification Status
Not Qualified
Power Supplies
0.95V
Number of I/O
312
RAM Size
2.6MB
Number of Inputs
312
Organization
1920 CLBS
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
530250
Total RAM Bits
21606000
Number of LABs/CLBs
30300
Number of CLBs
1920
Height Seated (Max)
2.71mm
Length
27mm
Width
27mm
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
XCKU040-2FBVA676E Product Details
XCKU040-2FBVA676E Overview
This package is included in the 676-BBGA, FCBGA package and is available for purchase. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. The I/Os are designed to facilitate a more coherent transfer of data. A fundamental building block consists of 530250 logic elements/cells. In order to operate fpga chips, a voltage supply of 0.95V volts is required. In this case, the FPGA part belongs to the Field Programmable Gate Arrays family. An attachment Surface Mount allows the FPGA module to be attached to the development board. Powered by a 0.922V~0.979V supply voltage, fpga chips is able to operate at high speeds. It is a type of FPGA belonging to the Kintex? UltraScale? seies. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~100°C TJ when the device is operating. During the installation of this device, 312 outputs were incorporated. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Fpga chips is designed wFpga chipsh 676 terminations. A device like this one offers 21606000 RAM bits, which is a considerable amount of memory. During the configuration of this FPGA module, the RAM si2.6MBe reaches 2.6MB to ensure that the program runs normally. The FPGA is built as an array of 30300 latches or CLBs. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. It is powered by a 0.95V battery, which can be purchased separately. In order to make the architecture work, 1920 CLBs are used.
XCKU040-2FBVA676E Features
312 I/Os Up to 21606000 RAM bits
XCKU040-2FBVA676E Applications
There are a lot of Xilinx Inc. XCKU040-2FBVA676E FPGAs applications.