XCKU040-3FFVA1156E Overview

There are two packages that contain fpga chips: 1156-BBGA, FCBGA package and X package. 520 I/Os are available for transferring data more efficiently. There are 530250 logic elements/cells to form a fundamental building block. 1V volts power it. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Powered by a 0.970V~1.030V supply voltage, fpga chips is able to operate at high speeds. It is a type of FPGA belonging to the Kintex? UltraScale? seies. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~100°C TJ while the machine is operating. There are 520 outputs incorporated in this device. As a result of space limitations, this FPGA model has been included in Bulk. The RAM bits that this device offer is 21606000. A significant amount of RAM is allocated to this FPGA module to ensure that the program can operate normally. Fpga electronics contains 30300 LABs/CLBs in an array. It is powered by a 1V battery, which can be purchased separately. In its architecture, there are 1920 CLB modules. In order to deliver high efficiency, fpga semiconductor operates at a frequency of 741MHz. A RAM memory provides data storage and avoids resource conflicts. The packing method fpga circuit adapts is TRAY, in order to sufpga circuit most design purposes in the industry.

XCKU040-3FFVA1156E Features

520 I/Os
Up to 21606000 RAM bits
Operating from a frequency of 741MHz

XCKU040-3FFVA1156E Applications

There are a lot of Xilinx Inc. XCKU040-3FFVA1156E FPGAs applications.

• Data center search engines
• Secure Communication
• Automation
• Military Temperature
• Camera time adjustments
• Medical imaging
• Solar Energy
• Wireless Communications
• Automotive driver's assistance
• Data Center