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XCKU11P-1FFVA1156I

XCKU11P-1FFVA1156I

XCKU11P-1FFVA1156I

Xilinx Inc.

FPGAs Kintex? UltraScale+? Series 1156-BBGA, FCBGA

SOT-23

XCKU11P-1FFVA1156I Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Mounting Type Surface Mount
Package / Case 1156-BBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Kintex® UltraScale+™
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.39.00.01
Voltage - Supply 0.825V~0.876V
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 464
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 653100
Total RAM Bits 53964800
Number of LABs/CLBs 37320
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
XCKU11P-1FFVA1156I Product Details

XCKU11P-1FFVA1156I Overview


In the 1156-BBGA, FCBGA package, you will find fpga chips. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. The device has 464 I/O ports for more coherent data transfer. A fundamental building block consists of 653100 logic elements/cells. Using a Surface Mount connector, you can mount this FPGA module on the development board. Fpga chips operates wFpga chipsh a supply voltage of 0.825V~0.876V. There are many types of FPGAs in the Kintex? UltraScale+? series, this is one of them. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. As a space-saving measure, this FPGA model is contained within Tray. As far as the RAM bits are concerned, this device offers you a total of 53964800. An array of 37320 LABs/CLBs is built into the FPGA.

XCKU11P-1FFVA1156I Features


464 I/Os
Up to 53964800 RAM bits

XCKU11P-1FFVA1156I Applications


There are a lot of Xilinx Inc. XCKU11P-1FFVA1156I FPGAs applications.

  • Military DSP
  • Security systems
  • Data Center
  • ADAS
  • Automotive advanced driver assistance systems (ADAS)
  • Embedded Vision
  • Medical imaging
  • Filtering and communication encoding
  • Software-defined radio
  • High Performance Computing

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