FPGAs Kintex? UltraScale+? Series 1517-BBGA, FCBGA
SOT-23
XCKU11P-1FFVE1517I Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
11 Weeks
Mounting Type
Surface Mount
Package / Case
1517-BBGA, FCBGA
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Series
Kintex® UltraScale+™
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.39.00.01
Voltage - Supply
0.825V~0.876V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
512
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
653100
Total RAM Bits
53964800
Number of LABs/CLBs
37320
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$3,943.38000
$3
XCKU11P-1FFVE1517I Product Details
XCKU11P-1FFVE1517I Overview
Fpga chips is supplied in the 1517-BBGA, FCBGA package. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. There are 512 I/Os for better data transfer. The basic building blocks of logic contain 653100 logic elements/cells. The Surface Mount-slot on the development board allows you to attach the FPGA module. A supply voltage of 0.825V~0.876V is needed in order for fpga chips to operate. FPGAs belonging to the Kintex? UltraScale+? series are a type of FPGA that belong to the Kintex? UltraScale+? series of FPGAs. The operating temperature should be kept at -40°C~100°C TJ when operating. There is an FPGA model contained in Tray in order to conserve space. Fpga electronics is worth mentioning that this device provides 53964800 bfpga electronics s of RAM. This FPGA is built as an array of 37320 LABs/CLBs.
XCKU11P-1FFVE1517I Features
512 I/Os Up to 53964800 RAM bits
XCKU11P-1FFVE1517I Applications
There are a lot of Xilinx Inc. XCKU11P-1FFVE1517I FPGAs applications.