XCKU11P-3FFVE1517E Overview

In the 1517-BBGA, FCBGA package, you will find fpga chips. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Having 512 I/Os makes data transfers more coherent. In order to construct a fundamental building block, 653100 logic elements/cells are required. Using a Surface Mount connector, you can mount this FPGA module on the development board. Fpga chips operates at a voltage of 0.873V~0.927V and uses a battery to supply power. The Kintex? UltraScale+? series FPGA is a type of FPGA that belongs to the Kintex? UltraScale+? family of FPGAs. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~100°C TJ at all times. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. The RAM bits that are offered by this fpga chips are 53964800. The FPGA consists of 37320 LABs/CLBs.

XCKU11P-3FFVE1517E Features

512 I/Os
Up to 53964800 RAM bits

XCKU11P-3FFVE1517E Applications

There are a lot of Xilinx Inc. XCKU11P-3FFVE1517E FPGAs applications.

• Bioinformatics
• Automation
• Medical Applications
• Digital signal processing
• Automotive Applications
• Industrial IoT
• Radar and Sensors
• OpenCL
• Industrial,Medical and Scientific Instruments
• Automotive advanced driver assistance systems (ADAS)