FPGAs Kintex? UltraScale+? Series 1517-BBGA, FCBGA
SOT-23
XCKU15P-2FFVE1517I Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
11 Weeks
Mounting Type
Surface Mount
Package / Case
1517-BBGA, FCBGA
Supplier Device Package
1517-FCBGA (40x40)
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Series
Kintex® UltraScale+™
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Voltage - Supply
0.825V~0.876V
Number of I/O
512
Number of Logic Elements/Cells
1143450
Total RAM Bits
82329600
Number of LABs/CLBs
65340
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$6,688.74000
$6
XCKU15P-2FFVE1517I Product Details
XCKU15P-2FFVE1517I Overview
In the 1517-BBGA, FCBGA package, you will find fpga chips. The device has 512 I/O ports for more coherent data transfer. Logic blocks consist of 1143450 logic elements/cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. Fpga chips operates at a voltage of 0.825V~0.876V and uses a battery to supply power. The Kintex? UltraScale+? series FPGA is a type of FPGA that belongs to the Kintex? UltraScale+? family of FPGAs. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. A device like this one offers 82329600 RAM bits, which is a considerable amount of memory. 65340 LABs/CLBs are configured on this FPGA. It employs 1517-FCBGA (40x40) as its supplier device package.
XCKU15P-2FFVE1517I Features
512 I/Os Up to 82329600 RAM bits
XCKU15P-2FFVE1517I Applications
There are a lot of Xilinx Inc. XCKU15P-2FFVE1517I FPGAs applications.
Aircraft navigation
Data center hardware accelerators
Automotive Applications
Software-defined radio
Software-defined radios
Ecosystem
Cryptography
ASIC prototyping
Medical Applications
Development Boards and Shields for Microcontrollers