FPGAs Kintex? UltraScale+? Series 1760-BBGA, FCBGA
SOT-23
XCKU15P-3FFVA1760E Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
11 Weeks
Mounting Type
Surface Mount
Package / Case
1760-BBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Series
Kintex® UltraScale+™
Part Status
Active
HTS Code
8542.39.00.01
Voltage - Supply
0.873V~0.927V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
512
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
1143450
Total RAM Bits
82329600
Number of LABs/CLBs
65340
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
XCKU15P-3FFVA1760E Product Details
XCKU15P-3FFVA1760E Overview
As part of the 1760-BBGA, FCBGA package, it is included. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 512 I/Os allow data to be transferred in a more coherent manner. The basic building blocks of logic contain 1143450 logic elements/cells. This FPGA module can be attached to the development board with a Surface Mount. In order to operate it, it requires a voltage supply of 0.873V~0.927V . It is a type of FPGA belonging to the Kintex? UltraScale+? seies. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~100°C TJ when the device is operating. As a result of space limitations, this FPGA model has been included in Tray. A device like this one offers 82329600 RAM bits, which is a considerable amount of memory. An array of 65340 LABs/CLBs is built into the FPGA.
XCKU15P-3FFVA1760E Features
512 I/Os Up to 82329600 RAM bits
XCKU15P-3FFVA1760E Applications
There are a lot of Xilinx Inc. XCKU15P-3FFVA1760E FPGAs applications.