FPGAs Kintex? UltraScale+? Series 1517-BBGA, FCBGA
SOT-23
XCKU15P-3FFVE1517E Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
11 Weeks
Mounting Type
Surface Mount
Package / Case
1517-BBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Series
Kintex® UltraScale+™
Part Status
Active
HTS Code
8542.39.00.01
Voltage - Supply
0.873V~0.927V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
512
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
1143450
Total RAM Bits
82329600
Number of LABs/CLBs
65340
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
XCKU15P-3FFVE1517E Product Details
XCKU15P-3FFVE1517E Overview
There is a 1517-BBGA, FCBGA package that includes this component. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. A total of 512 I/Os are programmed to ensure a more coherent data transfer. In order to construct a fundamental building block, 1143450 logic elements/cells are required. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 0.873V~0.927V, this device operates with ease. An FPGA belonging to the Kintex? UltraScale+? series is referred to as an FPGA. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~100°C TJ when the device is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Having a RAM bit size of 82329600 means that this device will offer you a lot of memory. The FPGA is built as an array of 65340 latches or CLBs.
XCKU15P-3FFVE1517E Features
512 I/Os Up to 82329600 RAM bits
XCKU15P-3FFVE1517E Applications
There are a lot of Xilinx Inc. XCKU15P-3FFVE1517E FPGAs applications.