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XCKU15P-3FFVE1517E

XCKU15P-3FFVE1517E

XCKU15P-3FFVE1517E

Xilinx Inc.

FPGAs Kintex? UltraScale+? Series 1517-BBGA, FCBGA

SOT-23

XCKU15P-3FFVE1517E Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Mounting Type Surface Mount
Package / Case 1517-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Series Kintex® UltraScale+™
Part Status Active
HTS Code 8542.39.00.01
Voltage - Supply 0.873V~0.927V
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 512
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 1143450
Total RAM Bits 82329600
Number of LABs/CLBs 65340
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
XCKU15P-3FFVE1517E Product Details

XCKU15P-3FFVE1517E Overview


There is a 1517-BBGA, FCBGA package that includes this component. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. A total of 512 I/Os are programmed to ensure a more coherent data transfer. In order to construct a fundamental building block, 1143450 logic elements/cells are required. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 0.873V~0.927V, this device operates with ease. An FPGA belonging to the Kintex? UltraScale+? series is referred to as an FPGA. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~100°C TJ when the device is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Having a RAM bit size of 82329600 means that this device will offer you a lot of memory. The FPGA is built as an array of 65340 latches or CLBs.

XCKU15P-3FFVE1517E Features


512 I/Os
Up to 82329600 RAM bits

XCKU15P-3FFVE1517E Applications


There are a lot of Xilinx Inc. XCKU15P-3FFVE1517E FPGAs applications.

  • Defense Applications
  • Industrial,Medical and Scientific Instruments
  • Automotive Applications
  • Military DSP
  • Data center hardware accelerators
  • High Performance Computing
  • Space Applications
  • Embedded Vision
  • Filtering and communication encoding
  • Artificial intelligence (AI)

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