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XCKU15P-L2FFVA1156E

XCKU15P-L2FFVA1156E

XCKU15P-L2FFVA1156E

Xilinx Inc.

FPGAs Kintex? UltraScale+? Series 1156-BBGA, FCBGA

SOT-23

XCKU15P-L2FFVA1156E Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Mounting Type Surface Mount
Package / Case 1156-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Series Kintex® UltraScale+™
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.39.00.01
Voltage - Supply 0.698V~0.876V
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 516
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 1143450
Total RAM Bits 82329600
Number of LABs/CLBs 65340
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
XCKU15P-L2FFVA1156E Product Details

XCKU15P-L2FFVA1156E Overview


In the 1156-BBGA, FCBGA package, you will find fpga chips. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. There are 516 I/Os for better data transfer. A fundamental building block consists of 1143450 logic elements/cells. By attaching the Surface Mount connector, you can use this FPGA module with your development board. This device is powered by a 0.698V~0.876V battery. An FPGA belonging to the Kintex? UltraScale+? series is referred to as an FPGA. While operating, the operating temperature should be kept within a range of 0°C~100°C TJ. This FPGA model is contained in Tray for space saving. The RAM bits that are offered by this fpga chips are 82329600. This FPGA is built as an array of 65340 LABs/CLBs.

XCKU15P-L2FFVA1156E Features


516 I/Os
Up to 82329600 RAM bits

XCKU15P-L2FFVA1156E Applications


There are a lot of Xilinx Inc. XCKU15P-L2FFVA1156E FPGAs applications.

  • Voice recognition
  • Military Temperature
  • Software-defined radios
  • High Performance Computing
  • Distributed Monetary Systems
  • Digital signal processing
  • Automotive driver's assistance
  • Embedded Vision
  • Data Center
  • Consumer Electronics

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