FPGAs Kintex? UltraScale+? Series 1760-BBGA, FCBGA
SOT-23
XCKU15P-L2FFVE1760E Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
11 Weeks
Mounting Type
Surface Mount
Package / Case
1760-BBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Series
Kintex® UltraScale+™
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.39.00.01
Voltage - Supply
0.698V~0.876V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
668
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
1143450
Total RAM Bits
82329600
Number of LABs/CLBs
65340
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
XCKU15P-L2FFVE1760E Product Details
XCKU15P-L2FFVE1760E Overview
Fpga chips is supplied in the 1760-BBGA, FCBGA package. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. Having 668 I/Os makes data transfers more coherent. A fundamental building block contains 1143450 logic elements or cells. The Surface Mount-slot connector on the FPGA module can be connected to the development board. This device is powered by a 0.698V~0.876V battery. It is a type of FPGA belonging to the Kintex? UltraScale+? seies. The operating temperature should be kept at 0°C~100°C TJ when operating. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. There are 82329600 RAM bits that are available with this device. A total of 65340 LABs/CLBs are included in this FPGA.
XCKU15P-L2FFVE1760E Features
668 I/Os Up to 82329600 RAM bits
XCKU15P-L2FFVE1760E Applications
There are a lot of Xilinx Inc. XCKU15P-L2FFVE1760E FPGAs applications.