XCKU3P-1FFVA676E Overview

In the package 676-BBGA, FCBGA, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 256 I/Os allow data to be transferred in a more coherent manner. Logic elements/cells form the fundamental building block of a computer. FPGA modules can be attached to development boards using a Surface Mount-connector. In order to operate it, it requires a voltage supply of 0.825V~0.876V . The Kintex? UltraScale+? Series is one of the types of FPGAs that belong to this type. While operating, the operating temperature should be kept within a range of 0°C~100°C TJ. As a space-saving measure, this FPGA model is contained within Tray. Having a RAM bit size of 31641600 means that this device will offer you a lot of memory. This FPGA is built as an array of 20340 LABs/CLBs.

XCKU3P-1FFVA676E Features

256 I/Os
Up to 31641600 RAM bits

XCKU3P-1FFVA676E Applications

There are a lot of Xilinx Inc. XCKU3P-1FFVA676E FPGAs applications.

• Aerospace and Defense
• Space Applications
• Data center hardware accelerators
• Automotive advanced driver assistance systems (ADAS)
• Embedded Vision
• Broadcast
• Automotive Applications
• Computer hardware emulation
• Medical ultrasounds
• Solar Energy