XCKU3P-1FFVD900E Overview

As part of the 900-BBGA, FCBGA package, it is included. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Having 304 I/Os makes data transfers more coherent. There are 355950 logic elements/cells to form a fundamental building block. The Surface Mount-slot on the development board allows you to attach the FPGA module. In order for it to operate, the supply voltage must be 0.825V~0.876V . This is a type of FPGA that is part of the Kintex? UltraScale+? series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~100°C TJ when operating the machine. There is an FPGA model contained in Tray in order to conserve space. This device has 31641600 RAM bits, which is the number of RAM bits that this device offers. The FPGA module's RAM si1.6MBe reaches 1.6MB in order to ensure that the program operates in a normal manner. Fpga electronics contains 20340 LABs/CLBs in an array.

XCKU3P-1FFVD900E Features

304 I/Os
Up to 31641600 RAM bits

XCKU3P-1FFVD900E Applications

There are a lot of Xilinx Inc. XCKU3P-1FFVD900E FPGAs applications.

• Automotive advanced driver assistance systems (ADAS)
• Medical ultrasounds
• Wireless Communications
• Secure Communication
• Enterprise networking
• Aerospace and Defense
• Automotive driver's assistance
• Integrating multiple SPLDs
• Industrial IoT
• Defense Applications