XCKU3P-1SFVB784E Overview

In the 784-BBGA, FCBGA package, you will find fpga chips. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. There are 304 I/Os for better data transfer. Logic blocks consist of 355950 logic elements/cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. The supply voltage of the device is 0.825V~0.876V , at which it runs. The Kintex? UltraScale+? Series is one of the types of FPGAs that belong to this type. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~100°C TJ when operating the machine. As a result of space limitations, this FPGA model has been included in Bulk. This device has 31641600 RAM bits, which is the number of RAM bits that this device offers. A total of 20340 LABs/CLBs make up this FPGA array.

XCKU3P-1SFVB784E Features

304 I/Os
Up to 31641600 RAM bits

XCKU3P-1SFVB784E Applications

There are a lot of Xilinx Inc. XCKU3P-1SFVB784E FPGAs applications.

• Development Boards and Shields for Microcontrollers
• DO-254
• Data Mining
• ASIC prototyping
• Software-defined radio
• Camera time adjustments
• Aircraft navigation
• Bioinformatics
• Automation
• Computer hardware emulation