XCKU3P-2FFVB676E Overview

In the package 676-BBGA, FCBGA, this product is provided. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. Having 280 I/Os makes data transfers more coherent. A fundamental building block consists of 355950 logic elements/cells. This FPGA module can be attached to the development board with a Surface Mount. With a supply voltage of 0.825V~0.876V, this device operates with ease. It is a type of FPGA belonging to the Kintex? UltraScale+? seies. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~100°C TJ when operating the machine. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. This device has 31641600 RAM bits, which is the number of RAM bits that this device offers. An array of 20340 LABs/CLBs is built into the FPGA.

XCKU3P-2FFVB676E Features

280 I/Os
Up to 31641600 RAM bits

XCKU3P-2FFVB676E Applications

There are a lot of Xilinx Inc. XCKU3P-2FFVB676E FPGAs applications.

• Solar Energy
• Image processing
• Software-defined radio
• Digital signal processing
• Enterprise networking
• Video & Image Processing
• Defense Applications
• Scientific Instruments
• Cryptography
• Device controllers