XCKU3P-2FFVD900E Overview

As part of the 900-BBGA, FCBGA package, it is included. The FIELD PROGRAMMABLE GATE ARRAY-series of FPGAs are composed of this type. A total of 304 I/Os allow data to be transferred in a more coherent manner. A fundamental building block contains 355950 logic elements or cells. The Surface Mount-slot connector on the FPGA module can be connected to the development board. This device is powered by a 0.825V~0.876V battery. It is a type of FPGA that belongs to the Kintex? UltraScale+? series of FPGAs. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~100°C TJ at all times. As a space-saving measure, this FPGA model is contained within Tray. There are 31641600 RAM bits that are available with this device. The FPGA is built as an array of 20340 latches or CLBs.

XCKU3P-2FFVD900E Features

304 I/Os
Up to 31641600 RAM bits

XCKU3P-2FFVD900E Applications

There are a lot of Xilinx Inc. XCKU3P-2FFVD900E FPGAs applications.

• Industrial IoT
• High Performance Computing
• Image processing
• Medical Electronics
• Computer hardware emulation
• ASIC prototyping
• Industrial Ethernet
• Cryptography
• Camera time adjustments
• Filtering and communication encoding