XCKU3P-2FFVD900I Overview

As part of the 900-BBGA, FCBGA package, it is included. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. A total of 304 I/Os are programmed to ensure a more coherent data transfer. There are 355950 logic elements/cells to form a fundamental building block. By attaching the Surface Mount connector, you can use this FPGA module with your development board. Fpga chips operates wFpga chipsh a supply voltage of 0.825V~0.876V. It is a type of FPGA that belongs to the Kintex? UltraScale+? series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. As a space-saving measure, this FPGA model is contained within Tray. This device has 31641600 RAM bits, which is the number of RAM bits that this device offers. An array of 20340 LABs/CLBs is built into the FPGA.

XCKU3P-2FFVD900I Features

304 I/Os
Up to 31641600 RAM bits

XCKU3P-2FFVD900I Applications

There are a lot of Xilinx Inc. XCKU3P-2FFVD900I FPGAs applications.

• Automotive
• High Performance Computing
• ASIC prototyping
• Server Applications
• Audio
• Automation
• Data center hardware accelerators
• Telecommunication
• DO-254
• Industrial,Medical and Scientific Instruments