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XCKU3P-2SFVB784I

XCKU3P-2SFVB784I

XCKU3P-2SFVB784I

Xilinx Inc.

FPGAs Kintex? UltraScale+? Series 784-BBGA, FCBGA

SOT-23

XCKU3P-2SFVB784I Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Mounting Type Surface Mount
Package / Case 784-BBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Packaging Bulk
Series Kintex® UltraScale+™
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.39.00.01
Voltage - Supply 0.825V~0.876V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code compliant
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 304
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 355950
Total RAM Bits 31641600
Number of LABs/CLBs 20340
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $1,820.00000 $1
XCKU3P-2SFVB784I Product Details

XCKU3P-2SFVB784I Overview


This package is included in the 784-BBGA, FCBGA package and is available for purchase. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. Having 304 I/Os makes data transfers more coherent. There are 355950 logic elements/cells to form a fundamental building block. An FPGA module can be attached to a development board with a Surface Mount-pin. The supply voltage of the device is 0.825V~0.876V , at which it runs. It is a type of FPGA belonging to the Kintex? UltraScale+? seies. Operating temperatures should be maintained within the -40°C~100°C TJ range at all times when the unit is in use. As a result of space limitations, this FPGA model has been included in Bulk. A device like this one offers 31641600 RAM bits, which is a considerable amount of memory. Fpga electronics contains 20340 LABs/CLBs in an array.

XCKU3P-2SFVB784I Features


304 I/Os
Up to 31641600 RAM bits

XCKU3P-2SFVB784I Applications


There are a lot of Xilinx Inc. XCKU3P-2SFVB784I FPGAs applications.

  • Software-defined radio
  • High Performance Computing
  • Artificial intelligence (AI)
  • Data center search engines
  • Space Applications
  • Scientific Instruments
  • Data Center
  • Automotive advanced driver assistance systems (ADAS)
  • Aircraft navigation
  • Development Boards and Shields for Microcontrollers

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