XCKU3P-3FFVA676E Overview

A 676-BBGA, FCBGA package is provided with this component. The FIELD PROGRAMMABLE GATE ARRAY-series of FPGAs are composed of this type. 256 I/Os are available for transferring data more efficiently. To form a fundamental building block, there are 355950 logic elements/cells. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order to operate it, it requires a voltage supply of 0.873V~0.927V . There are many types of FPGAs in the Kintex? UltraScale+? series, this is one of them. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~100°C TJ at all times. Using the Tray layout, this FPGA model can be contained in a very small amount of space. There are 31641600 RAM bits that are available with this device. This FPGA is built as an array of 20340 LABs/CLBs.

XCKU3P-3FFVA676E Features

256 I/Os
Up to 31641600 RAM bits

XCKU3P-3FFVA676E Applications

There are a lot of Xilinx Inc. XCKU3P-3FFVA676E FPGAs applications.

• Data center hardware accelerators
• Aerospace and Defense
• Broadcast
• Server Applications
• Software-defined radios
• Integrating multiple SPLDs
• Radar and Sensors
• Random logic
• Embedded Vision
• Voice recognition