XCKU3P-3FFVB676E Overview

The package that contains this software is called 676-BBGA, FCBGA. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. There are 280 I/Os for better data transfer. A fundamental building block consists of 355950 logic elements/cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. In order to operate it, it requires a voltage supply of 0.873V~0.927V . It is a type of FPGA that belongs to the Kintex? UltraScale+? series of FPGAs. While operating, the operating temperature should be kept within a range of 0°C~100°C TJ. It is for space saving reasons that this FPGA model is contained in Tray. As far as the RAM bits are concerned, this device offers you a total of 31641600. Fpga electronics contains 20340 LABs/CLBs in an array.

XCKU3P-3FFVB676E Features

280 I/Os
Up to 31641600 RAM bits

XCKU3P-3FFVB676E Applications

There are a lot of Xilinx Inc. XCKU3P-3FFVB676E FPGAs applications.

• DO-254
• Secure Communication
• Image processing
• Device controllers
• Space Applications
• Industrial,Medical and Scientific Instruments
• Military Temperature
• Automotive Applications
• Electronic Warfare
• Server Applications