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XCKU3P-L1FFVB676I

XCKU3P-L1FFVB676I

XCKU3P-L1FFVB676I

Xilinx Inc.

FPGAs Kintex? UltraScale+? Series 676-BBGA, FCBGA

SOT-23

XCKU3P-L1FFVB676I Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Mounting Type Surface Mount
Package / Case 676-BBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Kintex® UltraScale+™
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.39.00.01
Voltage - Supply 0.698V~0.876V
Number of I/O 280
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 355950
Total RAM Bits 31641600
Number of LABs/CLBs 20340
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
XCKU3P-L1FFVB676I Product Details

XCKU3P-L1FFVB676I Overview


A 676-BBGA, FCBGA package contains it, and it is available for download. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. The I/Os are designed to facilitate a more coherent transfer of data. A fundamental building block consists of 355950 logic elements/cells. FPGA modules can be attached to development boards using a Surface Mount-connector. In order for it to operate, the supply voltage must be 0.698V~0.876V . There are many types of FPGAs in the Kintex? UltraScale+? series, this is one of them. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. There is an FPGA model contained in Tray in order to conserve space. The RAM bits that this device offer is 31641600. 20340 LABs and CLBs are built into this FPGA.

XCKU3P-L1FFVB676I Features


280 I/Os
Up to 31641600 RAM bits

XCKU3P-L1FFVB676I Applications


There are a lot of Xilinx Inc. XCKU3P-L1FFVB676I FPGAs applications.

  • Solar Energy
  • Automation
  • Electronic Warfare
  • Video & Image Processing
  • Bioinformatics
  • Enterprise networking
  • Data Mining
  • Consumer Electronics
  • Artificial intelligence (AI)
  • Integrating multiple SPLDs

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