XCKU3P-L2FFVB676E Overview

There are two packages that contain fpga chips: 676-BBGA, FCBGA package and X package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. A total of 280 I/Os are programmed to ensure a more coherent data transfer. A fundamental building block contains 355950 logic elements or cells. The Surface Mount-slot on the development board allows you to attach the FPGA module. In order to operate it, it requires a voltage supply of 0.698V~0.876V . As part of the Kintex? UltraScale+? series of FPGAs, it is a type of FPGA. The operating temperature should be kept at 0°C~100°C TJ when operating. Using the Tray layout, this FPGA model can be contained in a very small amount of space. A device like this one offers 31641600 RAM bits, which is a considerable amount of memory. The FPGA consists of 20340 LABs/CLBs.

XCKU3P-L2FFVB676E Features

280 I/Os
Up to 31641600 RAM bits

XCKU3P-L2FFVB676E Applications

There are a lot of Xilinx Inc. XCKU3P-L2FFVB676E FPGAs applications.

• Voice recognition
• Server Applications
• Industrial Ethernet
• Video & Image Processing
• Embedded Vision
• Automotive
• Industrial,Medical and Scientific Instruments
• Broadcast
• Audio
• Ecosystem