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XCKU5P-2FFVD900E

XCKU5P-2FFVD900E

XCKU5P-2FFVD900E

Xilinx Inc.

FPGAs Kintex? UltraScale+? Series 900-BBGA, FCBGA

SOT-23

XCKU5P-2FFVD900E Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Mounting Type Surface Mount
Package / Case 900-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Series Kintex® UltraScale+™
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Voltage - Supply 0.825V~0.876V
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 304
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 474600
Total RAM Bits 41984000
Number of LABs/CLBs 27120
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $2,301.33000 $2
XCKU5P-2FFVD900E Product Details

XCKU5P-2FFVD900E Overview


As part of the 900-BBGA, FCBGA package, it is included. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. The device has 304 I/O ports for more coherent data transfer. A fundamental building block consists of 474600 logic elements/cells. This FPGA module can be attached to the development board with a Surface Mount. This device is powered by a 0.825V~0.876V battery. FPGAs belonging to the Kintex? UltraScale+? series are a type of FPGA that belong to the Kintex? UltraScale+? series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~100°C TJ when operating the machine. As a result of space limitations, this FPGA model has been included in Tray. The RAM bits that are offered by this fpga chips are 41984000. A total of 27120 LABs/CLBs are included in this FPGA.

XCKU5P-2FFVD900E Features


304 I/Os
Up to 41984000 RAM bits

XCKU5P-2FFVD900E Applications


There are a lot of Xilinx Inc. XCKU5P-2FFVD900E FPGAs applications.

  • Automotive Applications
  • Consumer Electronics
  • Development Boards and Shields for Microcontrollers
  • Military Temperature
  • Solar Energy
  • Video & Image Processing
  • Medical imaging
  • Broadcast
  • Random logic
  • Telecommunication

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